The Chinese government is offering scholarships to international students. The name of this scholarship is Chinese Government Scholarship (CSC). This scholarship will be available for three-year master’s and four-year PhD programs in the 2025-26 academic year.
Under the scholarship, selected students will have the opportunity to pursue a degree from Chongqing University in China. Chongqing University was established in 1950. It is currently one of the largest public universities in China. More than 25,000 students are studying at the university.
The application topics for postgraduate studies are:
- Information and Communication Engineering
- Management Science and Engineering
- Accounting
- Digital economy
- Translation and Interpreting
- Logistics Engineering and Management
- Network and Information Technology
- Law
- Control Science and Engineering
- Electrical Engineering
- Instrumental Science and Engineering
- Software Engineering
- Mechanical Engineering
- Mechanics
- Drama and Film
- Design.
The topics for applying for a PhD are:
- Information and Communication Engineering
- Computer Science and Technology
Scholarship opportunities
- Registration will be provided free of charge.
- No tuition fees required.
- Free accommodation is available on campus.
- Will provide medical insurance benefits
- 3,000 yuan per month for masters (49,600 taka in Bangladeshi currency)
- 3,500 yuan per month (57,878 taka in Bangladeshi currency) for PhD.
Application Eligibility
- Citizens of countries other than China can apply.
- Must be a bachelor’s degree holder under 35 years of age at the time of application (in the case of Masters)
- Must be a Master’s degree holder under 40 years of age at the time of application (in case of PhD)
- No other scholarship recipient may apply.
Required documents
- Chinese Government Scholarship Application Form
- Full curriculum vitae (CV)
- A study plan or research proposal
- Two letters of recommendation
- A copy of the passport
How to apply
- Interested candidates visit website for application details and application procedure .